Mpc8378 user manual

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The symbols used for timing specifications herein follow the pattern of t for inputs and t first two letters of functional block reference state signal state transmit timing MT for the time t MTX general, the clock reference symbol representation is based on USB Table Local Bus Table Table 40 describes the general timing parameters of the local bus interface of the device when in PLL bypass mode.

Local Bus Figure 20 through Figure 25 show the local bus signals. Local Bus Signals, Non-special Signals The constraints are for minimum and maximum delays, as well as JTAG JTAG Table Figure 35 provides the boundary-scan timing diagram.

The DC CLK Input Figure Difference in the period of any two adjacent PCI Express The parameters are specified at the component pins. PCI Express Table The exact reduced voltage level of the de-emphasized bit is always relative to the transition bit. The eye diagram must be valid for any consecutive UIs. A recovered calculated over Total Skew Skew The input receiver eye diagram is implementation specific and is not specified.

Rx component designer should provide additional margin to Compliance Test and Measurement Load The AC timing and voltage parameters must be verified at the measurement point, as specified within 0. SPI This table Figure Using this waveform, the definitions are as follows. To simplify illustration, the following definitions assume that the SerDes transmitter and receiver operate in a fully symmetrical differential signaling environment.

Differential Voltage Definitions for Transmitter or Receiver To illustrate these definitions using real values, consider the The SerDes reference clock input can be either differential or single-ended.

Refer to the Differential Mode and Single-ended Mode description below for further detailed requirements. This requirement is the same for both external DC-coupled or AC-coupled connection. High-Speed Serial Interfaces HSSI Figure 56 to Figure 59 fact that clock driver chip's internal structure, output impedance, and termination requirements are different between various clock driver chip manufacturers very possible that the clock circuit reference designs provided It also assumes that the LVDS transmitter establishes its own common mode level without relying on the receiver or other external component.

High-Speed Serial Interfaces HSSI clock driver chip manufacturer to verify whether this connection scheme is compatible with a particular clock driver chip. AC-Coupled Differential Connection with MHz range. Table 71 describes some AC parameters Package and Pin Listings Transmitter Figure Package and Pin Listings 4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls. Package and Pin Listings Table Clocking Clocking Table Thermal Table Package Thermal Characteristics for TePBGA II continued Parameter Junction-to-package natural convection on top Note: 1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site board temperature, ambient temperature, air flow, power Thermal The thermal performance of a device cannot be adequately predicted from the junction to ambient thermal resistance.

The thermal performance of any component is strongly dependent on the power dissipation of surrounding components. In addition, the ambient temperature varies Apache Log4j Update Please see this document here for current information regarding the Apache Log4j vulnerability. Need Windows 11 help? Already have an HP account? Select from the products you own. Choose a different product.

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